最大层数MAX LAYERS32 层L
最小线宽/线距MIN TRACE/SPACE3/3 mil
最小钻孔MIN DRILL0.15 mm
最小 BGA 间距MIN BGA PITCH0.3 mm
最大板尺寸MAX BOARD SIZE500×600 mm
01
PCB 制程能力PCB Fabrication Capability
| 参数Parameter | 能力范围Capability |
|---|---|
| 层数Layers | 1–32 层（含 HDI 一至三阶）1–32 layers incl. HDI 1st–3rd order |
| 板材Material | FR-4 · Rogers 4003/4350 · PTFE · 铝基 · 厚铜FR-4, Rogers 4003/4350, PTFE, aluminum, heavy copper |
| 板厚Thickness | 0.3 – 3.2 mm0.3 – 3.2 mm |
| 最小线宽 / 线距Trace / Space | 3 / 3 mil3 / 3 mil |
| 最小钻孔Min Drill | 机械 0.15 mm · 激光 0.1 mmMechanical 0.15mm · laser 0.1mm |
| 表面处理Surface Finish | HASL · ENIG · OSP · 沉银 · 沉锡HASL, ENIG, OSP, immersion silver/tin |
| 铜厚Copper Weight | 0.5 – 6 oz0.5 – 6 oz |
| 阻抗控制Impedance | ±10%（可 ±5%）±10% (down to ±5%) |
| 翘曲度Warpage | ≤0.75%（IPC-6012）≤0.75% per IPC-6012 |
| 阻焊颜色Solder Mask | 绿 / 蓝 / 黑 / 白 / 红Green / blue / black / white / red |
02
SMT 贴装能力SMT Assembly Capability
| 参数Parameter | 能力范围Capability |
|---|---|
| 贴装精度Placement Accuracy | ±0.03 mm±0.03 mm |
| 最小元件Min Component | 01005 / 020101005 / 0201 |
| BGA 间距BGA Pitch | ≥ 0.3 mm≥ 0.3 mm |
| 封装支持Packages | QFP · QFN · BGA · CSP · 连接器 · 异形件QFP, QFN, BGA, CSP, connectors, odd-form |
| 回流焊Reflow | 双轨 · 10 温区 · 无铅Dual-lane · 10-zone · lead-free |
| 检测设备Inspection | 3D SPI · AOI · X-Ray · 首件全检3D SPI, AOI, X-Ray, first-article full check |
| 特殊工艺Special Processes | 选择性波峰焊 · 底部填充 · 灌封Selective wave, underfill, potting |
▣ 03 · 设备与产线▣ 03 · EQUIPMENT & LINES
6 条高速产线 + 3 条样板线6 High-Speed Lines + 3 Prototype Lines
全自动产线 24 小时运转，设备与检测能力覆盖从印刷到整机测试的全流程。Fully automated lines run 24/7, covering everything from printing to system-level test.
SMT
SMT 产线SMT Lines
6 条高速线 + 3 条柔性样板线 · 24h 运转6 high-speed + 3 flexible prototype lines · 24/7
RF
回流焊Reflow Ovens
双轨 · 10 温区 · 无铅制程Dual-lane · 10-zone · lead-free
SPI
印刷与 SPIPrinting & SPI
全自动锡膏印刷 · 3D 检测Auto solder-paste printing · 3D SPI
AOI
AOI / X-RayAOI / X-Ray
炉前炉后全自动 AOI · X-Ray 空洞率检测Pre/post-reflow AOI · X-Ray voiding
TST
测试产线Test Lines
ICT · FCT · 老化测试 · 定制治具ICT, FCT, burn-in, custom fixtures
PL
贴片机Placement
全自动高速贴片机 · 精度 ±0.03mmHigh-speed auto placement · ±0.03mm
PCB
PCB 制板PCB Fab
自营制板厂 + 战略伙伴双保障Self-owned fab + strategic partners
CFC
三防设备Coating
选择性涂覆设备 · UV 荧光检测Selective coating · UV inspection
▣ 04 · 产能与交付▣ 04 · CAPACITY & DELIVERY
规模产能，准时交付Scale Capacity, On-Time Delivery
0万点/月M PTS/MOSMT 月产能Monthly SMT Capacity
0~5 天~5 DAYS样板交期Prototype Lead-Time
0%准时交付率On-Time Delivery Rate
0+交付国家Countries Served
文件格式支持FILE FORMATS
Gerber RS-274X
ODB++
XLS / CSV BOM
IPC-356
3D STEP
你的设计能达到什么工艺水平？What Can Your Design Achieve?
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